文献类型：期刊文献

英文题名：Silver Nanoparticle Decorated Boron Nitride for Reducing Interfacial Thermal Resistance in Thermal Conductivity Epoxy Resin Composite

作者：Wu, Xian Liu, Wei Ren, Li Zhang, Chun

第一作者：吴鑫

通信作者：Ren, L[1]|[14440187c8ff9988f1cf5]任粒;

机构：[1]Guizhou Inst Technol, Sch Mat & Energy Engn, Guiyang, Peoples R China

第一机构：贵州理工学院

通信机构：corresponding author), Guizhou Inst Technol, Sch Mat & Energy Engn, Guiyang, Peoples R China.|贵州理工学院;

年份：2025

外文期刊名：JOURNAL OF APPLIED POLYMER SCIENCE

收录：;EI(收录号：20251218089178);Scopus(收录号：2-s2.0-105000307684);WOS:【SCI-EXPANDED(收录号:WOS:001446717600001)】；

基金：This work was supported by the National Natural Science Foundation of China (518630003 and 52263004) and the Research Start Up Foundation for Advanced Talents of Guizhou Institute of Technology (Grant Number: XJGC20190668 and XJGC20190919).

语种：英文

外文关键词：Boron nitride - Elastomers - Electric insulation - Epoxy composites - Hard facing - Nitrides - Thermal conductivity of solids

摘要：The thermal conductivity of polymer composite is often constrained by the discontinuous structure of filler networks within the matrix and the high thermal contact resistance at filler interfaces. In response to these limitations, this study proposes a novel method for reducing interfacial thermal resistance by creating silver nanoparticle "bridges" through the deposition of silver onto filler surfaces. In this work, boron nitride (BN) hybrids modified with silver nanoparticles (BN-Ag) were synthesized via the in situ reduction of silver ions. A continuous BN-Ag framework was constructed using a sacrificial template method, followed by the infiltration of epoxy resin to produce an epoxy resin composite. At a filler content of 42.8%, the thermal conductivity of the composite increased from 1.36 Wm-1 K-1 for BN fillers to 2.57 Wm-1 K-1 for Ag nanoparticle-modified BN fillers, representing an improvement of 89%. The Foygel model was employed to fit the thermal conductivity data, revealing that the incorporation of silver nanoparticles effectively reduced the contact thermal resistance between fillers. Furthermore, the electrical insulating properties of the composite were preserved, making this design approach highly promising for the development of thermally conductive and electrically insulating polymer composites suitable for electronic applications.