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Effect of rhenium (Re) addition on the microstructure evolution, electrical conductivity and tensile properties of Al-Mg-Si alloy  ( SCI-EXPANDED收录 EI收录)  

文献类型:期刊文献

英文题名:Effect of rhenium (Re) addition on the microstructure evolution, electrical conductivity and tensile properties of Al-Mg-Si alloy

作者:Zhao, Xinhao Shen, Fanghua Chen, Huabiao Sun, Zhenzhong Zhang, Yuxun Yi, Danqing Li, Yingfen

第一作者:Zhao, Xinhao

通信作者:Shen, FH[1]

机构:[1]Dongguan Univ Technol, Sch Mech Engn, Dongguan 523808, Peoples R China;[2]Sichuan Univ, Sch Mat Sci & Engn, Chengdu 610064, Peoples R China;[3]Cent South Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China;[4]Guizhou Inst Technol, Coll Mat & Energy Engn, Guiyang 550003, Peoples R China

第一机构:Dongguan Univ Technol, Sch Mech Engn, Dongguan 523808, Peoples R China

通信机构:corresponding author), Dongguan Univ Technol, Sch Mech Engn, Dongguan 523808, Peoples R China.

年份:2026

卷号:26

期号:2

外文期刊名:ARCHIVES OF CIVIL AND MECHANICAL ENGINEERING

收录:;EI(收录号:20260620041358);Scopus(收录号:2-s2.0-105029505920);WOS:【SCI-EXPANDED(收录号:WOS:001681251600002)】;

基金:This article is funded by National Natural Science Foundation of China, 51701039, Fanghua Shen.

语种:英文

外文关键词:Al-Mg-Si alloy; Rhenium; Heat resistance; Texture; Tensile strength

摘要:Al-Mg-Si alloys have been widely used in industry due to their excellent formability, good strength, and electrical conductivity. However, they face challenges in meeting the requirements for high-temperature performance. In this work, the effects of rhenium (Re) addition (0, 0.1, and 0.3 wt%) on the microstructure, electrical conductivity, and tensile properties of annealed Al-Mg-Si cold rolled sheets were investigated. A texture index (XCB) was introduced to quantify texture evolution. The results show that Re addition increases the hardness of the annealed samples but reduces their electrical conductivity and overall texture intensity. The Al6(FeMn, Re) phase pins grain boundaries and enhances the thermal stability of the microstructure of the annealed samples. The CubeND texture {phi 1 = 20 degrees, phi = 0 degrees, phi 2 = 0 degrees} exhibits high thermal stability. The formation of submicron dimple bands (SDB) and reinforced tear edges (RTE) contributes to improving the room-temperature and high-temperature tensile strength of the alloy.

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