详细信息
Fe_(3)O_(4)@PDA@MWCNTs的制备及对室温硫化液体硅橡胶导热性能的影响
Effect of Fe_(3)O_(4)@PDA@MWCNTs on Properties of RTV Liquid Silicone Rubber Composites
文献类型:期刊文献
中文题名:Fe_(3)O_(4)@PDA@MWCNTs的制备及对室温硫化液体硅橡胶导热性能的影响
英文题名:Effect of Fe_(3)O_(4)@PDA@MWCNTs on Properties of RTV Liquid Silicone Rubber Composites
作者:周琴 吴兵 孙文奎 郝智
第一作者:周琴
机构:[1]贵州大学材料与冶金学院,贵州贵阳550025;[2]贵州理工学院工程训练中心,贵州贵阳550003;[3]贵州大学机械工程学院,贵州贵阳550025;[4]贵州华宇橡胶科技有限公司,贵州铜仁554000
第一机构:贵州大学材料与冶金学院,贵州贵阳550025
年份:2022
卷号:50
期号:8
起止页码:38-43
中文期刊名:塑料科技
外文期刊名:Plastics Science and Technology
收录:CSTPCD;;北大核心:【北大核心2020】;
基金:贵州省科技支撑计划项目(黔科合成果[2022]一般039)。
语种:中文
中文关键词:Fe_(3)O_(4)@MWCNTs;液体硅橡胶;导热性能;耐热性能
外文关键词:Fe_(3)O_(4)@MWCNTs;Liquid silicone rubber;Thermal conductivity;Heat resistance
摘要:采用多巴胺包覆处理多壁碳纳米管(MWCNTs),得到改性MWCNTs(PDA@MWCNTs)。将Fe_(3)O_(4)沉积到MWCNTs表面,制备Fe_(3)O_(4)@PDA@MWCNTs。将液体硅橡胶(SR)与Fe_(3)O_(4)@PDA@MWCNTs混合,制备SR/Fe_(3)O_(4)@PDA@MWCNTs复合材料。结果表明:Fe_(3)O_(4)@PDA@MWCNTs表面Fe的含量达到1.11%,负载后MWCNTs表面Fe_(3)O_(4)平均粒径为27.28 nm。随着Fe_(3)O_(4)@PDA@MWCNTs含量的增加,复合材料的导热性提高,热稳定性下降。当填料含量为100份时,复合材料的起始分解温度为284℃,导热系数为0.432 1 W/(m·K),比纯SR提升了73.5%。经过200 s加热,复合材料的表面温度达到42.3℃,具有良好的导热作用,满足CPU散热部件的使用要求。
Multi-walled carbon nanotubes(MWCNTs) were treated with dopamine coating to obtain modified MWCNTs(PDA@MWCNTs).Fe_(3)O_(4)was deposited on the surface of MWCNTs to prepare Fe_(3)O_(4)@PDA@MWCNTs.SR/Fe_(3)O_(4)@PDA@MWCNTs composites were prepared by mixing liquid silicone rubber(SR) with Fe_(3)O_(4)@PDA@MWCNTs.The results show that the content of Fe element on the surface of Fe_(3)O_(4)@PDA@MWCNTs reaches 1.11%.The average particle size of Fe_(3)O_(4)on the surface of MWCNTs after loading is 27.28 nm.With the increasing of Fe_(3)O_(4)@PDA@MWCNTs content,the thermal conductivity of the composites increases and the thermal stability decreases.When the filler content is 100 phr,the initial decomposition temperature of the composite is 284 ℃,and the thermal conductivity is 0.432 1 W/(m·K),which is 73.5% higher than that of pure SR.After 200 s heating,the surface temperature of the composite material reaches 42.3 ℃,which has good thermal conductivity and meets the requirements of CPU heat dissipation components.
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