文献类型：会议论文

英文题名：Effects of TiO2 Nanoparticles on Growth Behavior of IMCs between Sn/Cu joint during isothermal stage of soldering

作者：Xiao, Tianyu Shang, Shengyan

第一作者：Xiao, Tianyu

机构：[1] Guizhou Institute of Technology, School of Materials and Metallurgical Engineering, Guiyang, 550000, China

第一机构：贵州理工学院材料与冶金工程学院

通信机构：Guizhou Institute of Technology, School of Materials and Metallurgical Engineering, Guiyang, 550000, China|贵州理工学院材料与冶金工程学院;贵州理工学院;

会议论文集：2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023

会议日期：August 8, 2023 - August 11, 2023

会议地点：Shihezi City, China

语种：英文

外文关键词：Growth behavior; Heat preservation stage; IMC; Nanoparticles; Solder

年份：2023

摘要：Although Composite solder can improve the reliability of solder joint, there has been much investigations about the influence of NPs on the interfacial reaction of solder joint, underlying mechanism is still far from being understood. Therefore, it is an interesting and valuable work to investigate the growth mechanism of intermetallic compounds (IMC) under the interaction of different NPs. In this study, TiO2 NPs was introduced at the interface of Sn/Cu solder joint. Combined with high-pressure air purging liquid solder experiment, the effect of TiO2 NPs on the growth behaviour of Cu6Sn5 at the interface of Sn/Cu solder joint during the heat preservation stage of soldering has been studied. Form this study, it is observed that the Cu6Sn5 grain growth can be significantly hindered with the TiO2 NPs. At the initial stage of soldering, the number of Cu6Sn5 nucleation increases with the addition of TiO2 NPs, because it can provide heterogeneous nucleation cites for Cu6Sn5 grains. With the ongoing heat preservation stage, the adsorption of TiO2 NPs on the surface and grain boundaries of Cu6Sn5 grains decrease the Cu6Sn5 crystal grain surface energy and hinder the diffusion of Cu atoms from Cu substrate to the liquid solder, which will significantly suppress the Cu6Sn5 crystal grain growth. ? 2023 IEEE.