文献类型：期刊文献

英文题名：Atomic-scale study of multi-abrasive grinding of polycrystalline M42 high-speed steel under ultrasonic vibration: Microstructural and interfacial mechanisms

作者：Ji, Bin Wu, Huaichao Yang, Lv Huang, Xu Cao, Gang Yuan, Kui Chen, Xingyan

第一作者：Ji, Bin

通信作者：Wu, HC[1]

机构：[1]Guizhou Univ, Sch Mech Engn, Guiyang 550025, Peoples R China;[2]Guizhou Inst Technol, Sch Mech Engn, Guiyang 550003, Peoples R China

第一机构：Guizhou Univ, Sch Mech Engn, Guiyang 550025, Peoples R China

通信机构：corresponding author), Guizhou Univ, Sch Mech Engn, Guiyang 550025, Peoples R China.

年份：2026

卷号：214

外文期刊名：TRIBOLOGY INTERNATIONAL

收录：;WOS:【SCI-EXPANDED(收录号:WOS:001574973500001)】；

基金：This work was supported by Key Laboratory Project of Guizhou Higher Education Institutions (Grant No. Q. J. J [2023] 009) , Major Science and Technology Project in Guizhou Province (Grant No. Q. K. H. Z. D. Z. X. Z [2019] 3016) , Key Laboratory Project of Guizhou Province (Grant No. Q. K. H. P. T ZSYS [2025] 002) and Science and Technology Innovation Team Project in Guizhou Province (Grant No. Q. K. H. P. T. R. C [2020] 5020) .

语种：英文

外文关键词：Ultrasonic-assisted grinding; Molecular dynamics simulation; M42 high-speed steel; Multi-abrasive coupling

摘要：In this study, a molecular dynamics (MD) model of a nanocrystalline polycrystalline M42 high-speed steel (M42 HSS) workpiece and a multi-abrasive tool was developed to simulate ultrasonic-assisted grinding (UAG). The atomic-scale material removal behavior and microstructural evolution mechanisms under multi-abrasive interaction were investigated, and the influence of ultrasonic vibration parameters on grinding performance was systematically explored. The results show that UAG induces periodic jumping of abrasive particles, enhancing path overlap effects and abrasive coupling, thereby increasing the atomic removal rate by approximately 38 % and reducing plowing ridge height and grinding forces. High-frequency vibration loading triggers a synergistic mechanism combining thermal softening and mechanical impact, which expands the thermally affected region, improves chip evacuation, and facilitates stable material removal. At the microscopic level, periodic stress fluctuations effectively activate multiple dislocation slip systems (1/2 <111 >, <100 >, and <110 >), promoting dislocation-boundary synergy and forming stable wall-or network-like structures that enhance plastic deformation coordination. In contrast, conventional grinding (CG) is more prone to twinning nucleation in stress-concentrated regions and follows a linear slip-to-reconstruction evolution path. Overall, UAG shifts the deformation mechanism from uncontrolled intragranular dislocation proliferation to a more stable, multi-slip, and coordinated pathway driven by thermal-mechanical coupling, significantly improving subsurface structural stability and surface integrity. This study provides theoretical insights and atomistic-level evidence supporting efficient grinding and parameter optimization of difficult-to-machine materials.