文献类型：期刊文献

中文题名：Cu对Al-Si-Mg-xCu钎料组织及性能的影响研究

英文题名：Effect of Cu on microstructure and properties of Al-Si-Mg-xCu solders

作者：余静喜 伍玉娇 龙琼 罗弦

第一作者：余静喜

机构：[1]贵州大学材料与冶金工程学院;[2]贵州理工学院贵州省轻金属材料制备技术重点实验室

第一机构：贵州大学材料与冶金工程学院,贵州贵阳550003

年份：2018

卷号：0

期号：4

起止页码：48-53

中文期刊名：轻金属

外文期刊名：Light Metals

收录：北大核心:【北大核心2017】；CSCD:【CSCD_E2017_2018】；

基金：贵州省教育厅创新群体项目(黔教合KY字[2016]043);国家自然科学基金(51664009);贵州省科技计划项目(黔科合基础[2016]1067)

语种：中文

中文关键词：真空钎焊;铜含量;抗拉强度;断口形貌

外文关键词：vacuum brazing; copper eontent; tensile strength ; fracture morphology

摘要：试验采用Al-Si-Mg-x Cu系钎料,研究不同Cu含量对钎料组织和性能的影响,并将钎料真空钎焊6061铝合金,对焊接接头的抗拉强度、焊缝形貌和断口特征进行研究。研究结果表明,随着Cu含量的增加,钎料的液相线温度先降低后趋于平稳,而对钎料固相线无显著影响,钎料中脆性相Al2Cu也不断地增多,断口撕裂棱增多;但α-Al固溶体、Al2Cu、Al-Si-Cu和初生Si的形貌和分布基本不变,接头的抗拉强度先增大后减小,当Cu含量为12%时,Cu含量对钎料液相线温度的降低效果达到最大,接头抗拉强度到达最大值94MPa。
In this paper the effeet of different Cu eontent on the mierostructure and properties of solders is studied by using Al- Si - Mg - xCu series sold-ers, and the tensile strength of welded joints, the morphology and fracture characteristics of welding seam for vacuum brazing 6061 aluminum alloy is researched. The results show that the liquidus temperature of solder firstly decreases and then tends to be stable with the increase of Cu eontent, while the solid phase of solder has no significant influence. The brittle phase Al2 Cu in the solder is also inereasing and the tearing edge of fracture increases. However, the morphology and distribution of α - Al solid solution, Al2 Cu, Ai - Si - Cu and primary Si are almost unchanged, and the tensile strength of the joint increases first and then decreases. When the content of Cu is 12%, the effeet of Cu eontent on the liquidus temperature of solder reaches the maxi- mum, and the tensile strength reaches the maximum value of 94MPa.