文献类型：会议论文

英文题名：Influence of Cu Nanoparticles on IMCs between Sn/Cu joint during isothermal stage of soldering

作者：Shang, Shengyan Xiao, Tianyu

第一作者：Shang, Shengyan

通信作者：Shang, SY[1]

机构：[1]Guizhou Inst Technol, Sch Mat & Met Engn, Guiyang 550000, Peoples R China

第一机构：贵州理工学院材料与冶金工程学院

通信机构：corresponding author), Guizhou Inst Technol, Sch Mat & Met Engn, Guiyang 550000, Peoples R China.|贵州理工学院材料与冶金工程学院;贵州理工学院;

会议论文集：24th International Conference on Electronic Packaging Technology (ICEPT)

会议日期：AUG 08-11, 2023

会议地点：Shihezi, PEOPLES R CHINA

语种：英文

外文关键词：Solder; Intermetallic compounds; Isothermal stage; Growth behaviour; Nanoparticles

年份：2023

摘要：With the down-sized of the solder joint, the thickness of the intermetallic compounds (IMCs) layer increases at the interface of the solder joint. In addition, thick IMC layer can be a severe challenge due to its brittleness for the service life of solder joint. In this study, Cu nanoparticles (NPs) was introduced at the interface of Sn /Cu solder joint. Combined with high-pressure air purging liquid solder experiment, the e ffect of NPs on the growth behaviour of Cu6Sn5 at the interface of Sn /Cu solder joint during the heat preservation stage of soldering has been studied. At the beginning of heat preservation stage of soldering, Cu NPs not only provide heterogeneous nucleation sites but also partially dissolve in the liquid solder make the Cu concentration increase, which lead to the increase of the nuclei number of Cu6Sn5 grains and sharply decrease in the grain size. With the heat preservation stage ongoing, the e ffect of Cu NPs on growth of Cu6Sn5 is governed by two competing mechanisms. On the one hand, the increase of Cu concentration enhances the ripening growth of Cu6Sn5, which promotes the growth of Cu6Sn5; On the other hand, the reaction between Cu NPs and Sn lead to the formation of Cu6Sn5 NPs, which adsorb on the surface of Cu6Sn5 grains, reduce Cu6Sn5 surface energy and slow down the growth rate.