文献类型：期刊文献

中文题名：耐热酚醛树脂固化机理研究

英文题名：Research on Curing Process of Thermal Stable Phenolic Resin

作者：刘渊 杜婕 罗军 冯晓琴

第一作者：刘渊

机构：[1]贵阳学院材料磨损与腐蚀防护贵州省高校工程技术研究中心;[2]贵州理工学院化学工程学院

第一机构：贵阳学院材料磨损与腐蚀防护贵州省高校工程技术研究中心,贵州贵阳550005

年份：2015

卷号：43

期号：5

起止页码：35-37

中文期刊名：塑料科技

外文期刊名：Plastics Science and Technology

收录：CSTPCD;;北大核心:【北大核心2014】；

基金：贵州省教育厅产学研基地项目(黔教合KY字[2013]126号);贵州省科技厅联合基金项目(黔科合LH字[2014]7163号);贵州省科技厅工业攻关项目(黔科合GY字[2012]3038)

语种：中文

中文关键词：酚醛树脂;耐热性;固化反应;活化能

外文关键词：Phenolic resin; Thermal stable; Curing reaction; Activation energy

摘要：采用相同配比的酚类和醛类物质合成了两种酚醛树脂——普通酚醛树脂和耐热改性酚醛树脂。利用差示扫描量热仪(DSC)将两种树脂在不同升温速率下进行固化,并用Ozawa方程对这两种酚醛树脂固化过程的活化能进行了计算。结果表明:普通酚醛树脂的峰值固化温度为197.45℃,固化反应的活化能为41.4 k J/mol;耐热改性酚醛树脂的峰值固化温度为237.23℃,固化反应的活化能为50.0 k J/mol。
Two kinds of phenolic resins were synthesized in this paper, pure phenolic resin and thermal stable phenolic resin. Moreover, the curing processes of the two phenolic resins were investigated by DSC under different heating rates. The activation energy of the curing reaction was evaluated by Ozawa equation. The results indicate that the peak curing temperature of pure phenolic resin is 197.45℃, and the peak curing temperature of thermal stable phenolic resin is 237.23℃. Furthermore, the activation energy of thermal stable phenolic resin is 50.0 kJImol which is higher than that of pure phenolic resin, 41.4 kJ/mol.