文献类型：期刊文献

英文题名：Investigation of Wear Behavior for Innovative Cutting Tool in Machining AISI 304 Stainless Steel

作者：Wu, Jinxing Hu, Wenhao Zhang, Yi Wu, Yanying Wu, Changcheng Yang, Zuode

第一作者：Wu, Jinxing

通信作者：Wu, JX[1];Wu, JX[2];Wu, JX[3]

机构：[1]Guizhou Minzu Univ, Sch Phys & Mechatron Engn, Guiyang 550025, Peoples R China;[2]Guiyang Xianfeng Machine Tool Co Ltd, Guiyang 550601, Peoples R China;[3]Guizhou Univ, Sch Mech Engn, Guiyang 550025, Peoples R China;[4]Guizhou Inst Technol, Sch Mech Engn, Guiyang 550003, Peoples R China

第一机构：Guizhou Minzu Univ, Sch Phys & Mechatron Engn, Guiyang 550025, Peoples R China

通信机构：corresponding author), Guizhou Minzu Univ, Sch Phys & Mechatron Engn, Guiyang 550025, Peoples R China;corresponding author), Guiyang Xianfeng Machine Tool Co Ltd, Guiyang 550601, Peoples R China;corresponding author), Guizhou Univ, Sch Mech Engn, Guiyang 550025, Peoples R China.

年份：2025

卷号：6

期号：9

外文期刊名：ENG

收录：EI(收录号：20254019265530);Scopus(收录号：2-s2.0-105017427776);WOS:【ESCI(收录号:WOS:001579725500001)】；

基金：This study was supported by the Guizhou Minzu University Scientific Research Fund Sponsored Project. (No. GZMUZK [2022]YB01); Doctoral funding project of Guizhou Minzu University GZMUZK [2024]QD72; Guizhou Provincial Science and Technology Program Projects (Grant No: KJZY [2025]082 and No: KJZY [2025]080).

语种：英文

外文关键词：micro-groove tool; cutting force; tool wear; decrease

摘要：AISI 304 stainless steel is widely used in the equipment manufacturing industry due to its excellent corrosion resistance. However, its high toughness and plasticity lead to severe tool wear during machining, significantly shortening the tool's life. To mitigate tool wear, this study designed and fabricated a novel micro-groove structure on the tool's rake face, aiming to reduce friction and thermal stress. The performance of the micro-groove tool was evaluated through cutting simulations and durability tests. Results demonstrate that this micro-groove structure effectively reduces cutting forces, suppresses tool wear, and improves chip control and heat dissipation.