文献类型：期刊文献

中文题名：填充Co的CoCrCuFeNi高熵合金扩散焊接头的组织和扩散机制

英文题名：Microstructure and Diffusion Mechanism of CoCrCuFeNi HEA Joints Diffusion Welded Using Co Filler

作者：李娟 罗少敏 赵宏龙 周念 秦庆东

第一作者：李娟

通信作者：Qin, QD[1]

机构：[1]贵州理工学院贵州省轻金属材料制备技术重点实验室,贵州贵阳550003;[2]贵州理工学院材料与能源工程学院,贵州贵阳550003;[3]贵州理工学院贵州省特种功能材料2011协同创新中心,贵州贵阳550003

第一机构：贵州理工学院

通信机构：corresponding author), Guizhou Inst Technol, Key Lab Light Met Mat Proc Technol Guizhou Prov, Guiyang 550003, Peoples R China.|贵州理工学院;

年份：2023

卷号：52

期号：4

起止页码：1176-1183

中文期刊名：稀有金属材料与工程

外文期刊名：Rare Metal Materials and Engineering

收录：CSTPCD;;EI(收录号：20232314196178);Scopus;WOS:【SCI-EXPANDED(收录号:WOS:000976102200002)】；北大核心:【北大核心2020】；CSCD:【CSCD2023_2024】；

基金：Foundation item: Guizhou Province Science and Technology Planning Project (Qianke He Jichu ZK[2022] Yiban 175); National Natural Science Foundation of China (51964011); Education Department Youth Science and Technology Talent Growth Project of Guizhou Province (Qian Jiao He KY [2022] 342); Special Project for Cultivation and Innovation Exploration of New Academic Talents of Guizhou Institute of Technology (GZLGXM-13); High Level Talent Program of Guizhou Institute of Technology (XJGC20190916); Guzhou Province High Level Innovative Talents (Qianke He Platform and Talent (2022) 011-1); Guzhou Colleges and Universities Process Industry New Process Engineering Research Center (QianJiaoJi (2022)034)

语种：中文

中文关键词：高熵合金;扩散焊;显微组织;扩散系数;扩散机制

外文关键词：high-entropy alloy;diffusion welding;microstructure;diffusion coefficient;diffusion mechanism

摘要：在850,950,1050和1100℃下,填充Co中间层对CoCrCuFeNi高熵合金(HEA)进行了扩散焊接,并对接头微观组织和扩散机制进行了分析。结果表明,在各温度下接头均形成了牢固的结合,接头无金属间化合物生成,高熵合金侧界面周围残留部分柯肯达尔孔。对Cr、Fe、Cu和Ni在Co填充层中的扩散系数进行了计算,排序如下:Cu>Cr>Fe>Ni。所有元素的扩散速度均在相同水平,CoCrCuFeNi高熵合金和Co填充层之间的扩散是在空位机制和晶界扩散机制的共同作用下发生的。
A CoCrCuFeNi high-entropy alloy(HEA)was diffusion welded using a Co filler at 850,950,1050,and 1100°C,and the microstructure and diffusion mechanism of the joints were examined.Results show that firm connections are achieved at each temperature,no intermetallic compound forms in the joints,and some Kirkendall voids are remained on the HEA side around the interface.The diffusion coefficients of Cr,Fe,Ni,and Cu in the Co filler at 850 and 950°C are calculated,ranked as follows:Cu>Cr>Fe>Ni.The diffusion rates of all elements are at the same level.The diffusion between the CoCrCuFeNi HEA and Co filler occurs under the combined action of the vacancy and grain boundary diffusion mechanisms.