文献类型：期刊文献

英文题名：Constructing Porous Alumina Frameworks by Sintering for Enhanced Thermal Conductivity of Polymer Composites

作者：Wu, Xian Liu, Wei Shi, Fa-guo Zhang, Chun

第一作者：吴鑫

通信作者：Zhang, C[1]|[14440f6a6d277849ce3bf]张纯;

机构：[1]Guizhou Inst Technol, Sch Mat & Energy Engn, Guiyang 550003, Peoples R China;[2]Guizhou Yong Hong Aviat Machinery Co LTD, Guiyang 550003, Peoples R China

第一机构：贵州理工学院

通信机构：corresponding author), Guizhou Inst Technol, Sch Mat & Energy Engn, Guiyang 550003, Peoples R China.|贵州理工学院;

年份：0

外文期刊名：ACS OMEGA

收录：;Scopus(收录号：2-s2.0-85144393893);WOS:【SCI-EXPANDED(收录号:WOS:000903302900001)】；

基金：This work was supported by the National Natural Science Foundation of China (518630003), Research start-up Foundation for Advanced Talents of Guizhou Institute of Technology (grant number XJGC20190668), Research Program of the Science and Technology Department of Guizhou Province (QianKeHeJiChu-ZK [2022]YiBan179), and Research Institute Service Enterprise Action Plan Project of Guizhou Province (no. [2018]4010).

语种：英文

摘要：Constructing continuous filler networks in a polymer matrix can significantly improve the thermal conductivity of the composite. In this study, we fabricated porous Al2O3 frameworks (f-AO) by decomposing the sacrificial material and sintering to serve as heat conduction pathways in the matrix. Then, epoxy/Al2O3 frameworks (EP/f-AO) composites with excellent thermal conductivity were obtained by vacuum infiltration. The pre-constructed Al2O3 frameworks and sintering reduce interfacial thermal resistance by 1 order of magnitude and result in a dramatically enhanced thermal conductivity of EP/f-AO composites. At the filler content of 49.5 vol %, the thermal conductivity of the EP/f-AO composite is 6.96 W m-1 K-1, which is 4.3 times that of the EP/AO composite (1.61 W m-1 K-1) with randomly dispersed fillers. The heat dissipation capability of the EP/f-AO composites was further confirmed by infrared thermal imaging. This study provides a promising approach for fabricating thermal conductive polymer composites as electronic package materials.