文献类型：期刊文献

英文题名：Constructing three-dimensional boron nitride network for highly thermally conductive epoxy resin composites

作者：Wu, Xian Liu, Wei Shi, Fa-guo Yang, Le Zhang, Chun

第一作者：吴鑫

通信作者：Zhang, C[1]|[14440f6a6d277849ce3bf]张纯;

机构：[1]Guizhou Inst Technol, Sch Mat & Energy Engn, Guiyang 550003, Peoples R China;[2]Guizhou Yong Hong Aviat Machinery Co Ltd, Guiyang, Peoples R China

第一机构：贵州理工学院

通信机构：corresponding author), Guizhou Inst Technol, Sch Mat & Energy Engn, Guiyang 550003, Peoples R China.|贵州理工学院;

年份：2022

卷号：43

期号：3

起止页码：1711-1717

外文期刊名：POLYMER COMPOSITES

收录：;EI(收录号：20220711632292);Scopus(收录号：2-s2.0-85124417620);WOS:【SCI-EXPANDED(收录号:WOS:000750951100001)】；

基金：National Natural Science Foundation of China, Grant/Award Number: 518630003; Research start-up Foundation for Advanced Talents of Guizhou Institute of Technology, Grant/Award Number: XJGC20190668

语种：英文

外文关键词：boron nitride; epoxy resin; thermal conductive network; thermal conductivity

摘要：Construction of heat conduction channels in polymer matrix plays a key role in thermally conductive composite. In this work, three-dimensional (3D) boron nitride (BN) framework was successfully fabricated by decomposing the sacrificial material. The resultant 3D-BN framework with honeycomb-like structure was further infiltrated with liquid epoxy resin. With the aid of thermally conductive pathways formed by the 3D-BN framework, the maximum thermal conductivity of EP/3D-BN composites reaches 3.53 W/m center dot K with 55.85 vol% BN, which is 17.6 times larger than that of pure EP. The EP/3D-BN composites demonstrate strong capability to dissipate the heat during heating and cooling processes. This work provides a facile method for developing thermal conductive composites applied in thermal management for electronics.