文献类型：期刊文献

英文题名：Flexible silicone rubber/carbon fiber/nano-diamond composites with enhanced thermal conductivity via reducing the interface thermal resistance

作者：Wang, Chaoyu Shen, Junqi Hao, Zhi Luo, Zhu Shen, Zong Li, Xiaolong Yang, Le Zhou, Qin

第一作者：Wang, Chaoyu

通信作者：Hao, Z[1]

机构：[1]Guizhou Univ, Coll Mat & Met, Guiyang 550025, Peoples R China;[2]Huazhong Univ Sci & Technol, Sch Chem & Chem Engn, Key Lab Mat Chem Energy Convers & Storage, Minist Educ, Wuhan 430074, Peoples R China;[3]Guizhou Inst Technol, Sch Mat & Energy Engn, Guiyang 550025, Peoples R China

第一机构：Guizhou Univ, Coll Mat & Met, Guiyang 550025, Peoples R China

通信机构：corresponding author), Guizhou Univ, Coll Mat & Met, Guiyang 550025, Peoples R China.

年份：0

外文期刊名：JOURNAL OF POLYMER ENGINEERING

收录：;EI(收录号：20221712011458);Scopus(收录号：2-s2.0-85128558481);WOS:【SCI-EXPANDED(收录号:WOS:000776136500001)】；

基金：This work was supported by Scientific Research Project of Introducing Talents of Guizhou University ([2020] 53) and financially supported by the Science and Technology Department of Guizhou Province (grant no. Platform & Talents [2019] 2030).

语种：英文

外文关键词：carbon fiber; nano-diamond; silicon rubber; thermal conductivity

摘要：Insulating materials with heat dissipation are urgently required for modern electronic devices and systems. In this study, 4,4-methylene diphenyl diisocyanate was used as the coupling agent, and nano-diamond (ND) particles were grafted onto the surface of carbon fibers (CFs) to prepare CF-ND/silicone rubber (SR) composites. The ND acted as a "bridge" among CFs, which can reduce the interface thermal resistance between CFs because the dot-like ND can increase the interfacial area of CFs, making it easier to form heat-conducting networks between SR. When the content of CF-ND (1:6) was 20%, the thermal conductivity of the SR composite was 0.305 W/(m center dot K), 69% higher than that of pure SR. The ND between CFs can improve the dynamic mechanical properties by acting as a crack pinhole. In addition, the CF-ND/SR composites also exhibited excellent thermal stability. This work has enormous potential for advanced electronic devices.