成果/Result
- Effects of TiO2 Nanoparticles on Growth Behavior of IMCs between Sn/Cu joint during isothermal stage of soldering被引量：11收藏
- 作者：Xiao, Tianyu Shang, Shengyan
- 机构： Guizhou Institute of Technology
- 来源：2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023 2023
- Influence of Cu Nanoparticles on IMCs between Sn/Cu joint during isothermal stage of soldering被引量：10收藏
- 作者：Shang, Shengyan Xiao, Tianyu
- 机构： Guizhou Institute of Technology
- 来源：2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023 2023
