- Effects of TiO2 Nanoparticles on Growth Behavior of IMCs between Sn/Cu joint during isothermal stage of soldering被引量：0收藏
- 作者：Xiao, Tianyu Shang, Shengyan
- 机构： Guizhou Institute of Technology
- 来源：2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023 2023
- 关键词：Growth behavior Heat preservation stage IMC Nanoparticles Solder
- Effects of TiO2 Nanoparticles on Growth Behavior of IMCs between Sn/Cu joint during isothermal stage of soldering被引量：0收藏
- 作者：Xiao, Tianyu Shang, Shengyan
- 机构：Guizhou Inst Technol
- 来源：2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT 2023
- 关键词：Solder IMC Heat preservation stage Growth behavior Nanoparticles
- Influence of Cu Nanoparticles on IMCs between Sn/Cu joint during isothermal stage of soldering被引量：0收藏
- 作者：Shang, Shengyan Xiao, Tianyu
- 机构：Guizhou Inst Technol
- 来源：2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT 2023
- 关键词：Solder Intermetallic compounds Isothermal stage Growth behaviour Nanoparticles
